UMTS / HE910 V2-Family

The HE910-V2 is an HSPA+ multi-band LGA module series. It is fully digital audio capable, and includes both GPS and GLONASS location technologies.

It is a member of the xE910 LGA unified form factor family with pin-to-pin compatibility across its LTE, HSPA, HSPA+, GSM/GPRS and CDMA/EVDO family counterparts.

With data rates of 14.4 Mbps down and 5.76 Mbps up, the HE910-V2 series is particularly well-suited for devices with high throughput requirements such as mobile computing, in-car telematics, PDAs, e-readers, tablet PCs, and consumer electronics in general.

Variants are offered to address specific regional frequency-band requirements

Key Benefits

  •     Design once and deploy globally, thanks to xE910 unified form factor
  •     Banded for worldwide HSPA+ coverage
  •     LGA package ideally suited for low profile integrated solutions, reducing cost in high-volume applications, as well as saving space and weight in portable devices
  •     Perfect platform for applications such as mobile computing devices, PDAs, smartphones, tablet PCs and consumer electronics in general, both for business and personal life
  •     Optional GPS ideal for applications requiring indoor fixes and simultaneous GPS with voice and data

Family Concept
The xE910 Unified Form Factor family is comprised of pin-to-pin compatible modules in Telit's broadest range of cellular air interfaces and band combinations making it a pillar of the concept "design once and deploy globally".

A one-time design and integration effort enables worldwide or regional device re-use across different data rates and wireless technologies with air interfaces in GSM/GPRS, UMTS/HSPA+, 1xRTT, EV-DO, and LTE (pre-release).

The xE910 family was conceived to enable applications to be easily upgraded in a number of ways. For example: migrating from 2G to 3G or 4G; or upgrading from 2 bands to 3, 4, or more. The family fully preserves the core design of the application or device from launch to phase-out with modules packaged in a common 28.2x28.2 mm LGA footprint. It is recommended for mid to high-volume, compact sized applications.

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